SemiconductorA leader in the HBM Glue Cleaner
for the AI Semiconductor
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Proprietary Synthesis and
Refinement TechnologySupplying Ultra High Purity Chemicals through
proprietary synthesis and refinement technology.
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HBM Glue Cleaner
Market LeaderMarket leader in HBM Glue Cleaner,
driving the AI semiconductor market.
Process Chemical
Managing purity and impurity control, which have a decisive impact on the yield of each process, to provide high-purity products with consistent performance.
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Main Products
- IPA
- KrF PR Thinner
- EBR Thinner
Performance Chemical
As a leader in the HBM and FOWLP Glue Cleaner field, we develop and supply TSV Cleaner and PR Stripper.
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Main Products
- TSV Glue Cleaner
- TSV Backside Wafer Cleaner
- FOWLP Glue Cleaner
- FOWLP Edge bead Remover
- Positive PR Stripper
- Negative PR Stripper
Specialty Chemical
Through proprietary synthesis and refinement technology, we maintain purity levels above 99.999% and control impurities at ppt levels, meeting the demands of EUV technology.
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Main Products
- PGMEA
- MIBC
- CPN
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IPA
High-purity IPA is primarily used as a wafer cleaning material in semiconductor manufacturing processes and is optimized for use in semiconductor processes with a purity of over 99.999% and complete impurity removal.
Purity - 99.999%
Metal - 2ppt ↓
Impurity - TBA, Acetone N.D
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Thinner
Thinners for semiconductors are used in the EBR (Edge Bead Removal) process to remove unnecessary photoresist from the edges of silicon wafers after photoresist coating and in the RRC (Resist Reduction Coating) process to reduce photoresist usage.
| Product | Feature |
|---|---|
| KrF PR Thinner |  Photoresist Reduction Effect |
| EBR Thinner | Excellent Photoresist Removal Capability |
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HBM Glue Cleaner
This product is designed for glue removal after the debonding process in semiconductor WLP (Wafer Level Package) processes. It is specialized for HBM3E and FOWLP products, effectively removing glue without causing bump damage.
| Product | Feature |
|---|---|
| TSV Adhesive Remover | Excellent Removal Performance
No Metal Damage |
| TSV Backside Wafer Cleaner | |
| FOWLP Adhesive Remover | Optimization for Fan-Out Process |
| FOWLP Edge bead Remover |
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Stripper
The semiconductor strippers are used for removing positive or negative photoresist in WLP (Wafer Level Package) processes. These strippers are eco-friendly and can strip photoresist without causing bump damage.
| Product | Feature |
|---|---|
| Positive PR Stripper | No Bump Damage |
| Negative PR Stripper |
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EUV Materials
To supply thinner raw materials required for EUV processes, we manage purity levels exceeding 99.999% and impurities at ppt levels based on advanced synthesis and refinement technologies.
| Product | Feature |
|---|---|
| PGMEA | Purity 99.999% |
| MIBC | EUV PR Raw Material |
| CPN | EUV Thinner Raw Material |
